Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676767 | Thin film capacitor having a dielectric layer having a through hole whose inner surface has first and second tapered surfaces, circuit board incorporating the same, and thin film capacitor manufacturing method | Yuuki Aburakawa, Akiyasu Iioka, Hitoshi Saita, Kazuhiro Yoshikawa | 2023-06-13 |