Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682628 | Semiconductor IC-embedded substrate having heat dissipation structure and its manufacturing method | Masashi Katsumata, Yoshihiro Suzuki | 2023-06-20 |
KT
Kazutoshi TSUYUTANI
Overall (2023): #371,626 of 537,848Top 70%
1
Patents 2023