Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11753708 | High strength/highly conductive copper alloy plate material and manufacturing method therefor | Yusuke Saito, Sigeyuki Nakano | 2023-09-12 |
| 11638973 | Silver brazing material and joining method using the silver brazing material | Masahiro Takahashi, Takashi Terui, Kotaro Matsu | 2023-05-02 |