HH

Hongjun Hei

TT Taiyuan University Of Technology: 1 patents #21 of 101Top 25%
Overall (2023): #422,221 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11761063 Method for preparing high-entropy alloy composites reinforced by diamond particles Yongsheng Wang, Shengwang Yu, Changxing Han, Naixu Wang, Bing Zhou +3 more 2023-09-19