Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11643544 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same | Chih-Wei Liao, Ju-Ming Huang | 2023-05-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11643544 | Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same | Chih-Wei Liao, Ju-Ming Huang | 2023-05-09 |