Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610901 | Semiconductor device having a butted contact, method of forming and method of using | Chih-Ming Lee, Hsin-Chi Chen, Hsun-Ying Huang | 2023-03-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610901 | Semiconductor device having a butted contact, method of forming and method of using | Chih-Ming Lee, Hsin-Chi Chen, Hsun-Ying Huang | 2023-03-21 |