Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11834325 | Piezoelectric anti-stiction structure for microelectromechanical systems | Fan Hu, Chun-Ren Cheng, Hsiang-Fu Chen | 2023-12-05 |
| 11747298 | Wafer-level packaging of solid-state biosensor, microfluidics, and through-silicon via | Allen Timothy Chang, Jui-Cheng Huang, Yu-Jie Huang | 2023-09-05 |
| 11667522 | MEMS package comprising multi-depth trenches | Fan Hu | 2023-06-06 |