Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610982 | Void elimination for gap-filling in high-aspect ratio trenches | Chih-Hsiang Fan, Jia-Ming Lin, Wei-Chin Lee, Hsien-Ming Lee, Chi On Chui | 2023-03-21 |
TS
Tsung-Han Shen
Overall (2023): #219,853 of 537,848Top 45%
1
Patents 2023