Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784225 | Semiconductor structure, method of forming stacked unit layers and method of forming stacked two-dimensional material layers | Tse-An Chen, Tung Ying Lee, Lain-Jong Li | 2023-10-10 |