Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855007 | Semiconductor structure | Rung-De Wang, Chen-Hsun Liu, Chin-Yu Ku, Te-Hsun Pang, Chia-Hua Wang +1 more | 2023-12-26 |
| 11731323 | Microwave and electromagnetic heated foaming method, mold and foaming material thereof | Kuang-Tse Chin, Jung-Hsiang Hsieh, Ya-Chun Yu | 2023-08-22 |
| 11735646 | Rinse process after forming fin-shaped structure | Bo-Han Huang, Chih-Chung Chen, Chun-Hsien Lin, Shih-Hung Tsai, Po-Kuang Hsieh | 2023-08-22 |