Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11634832 | Plating system and method of plating wafer | Ming-Hsien Lin | 2023-04-25 |
KH
Kuo-Lung HOU
Overall (2023): #360,557 of 537,848Top 70%
1
Patents 2023