KL

Kun-Mo Lin

TSMC: 1 patents #2,163 of 4,064Top 55%
📍 New Taipei, TW: #609 of 1,884 inventorsTop 35%
Overall (2023): #360,256 of 537,848Top 70%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11725278 Systems and methods for a plasma enhanced deposition of material on a semiconductor substrate Yi-Hung Lin, Jr-Hung Li, Tze-Liang Lee, Ting-Gang Chen, Chung-Ting Ko 2023-08-15