Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11593546 | Integrated circuit with thicker metal lines on lower metallization layer | Yuan-Te Hou, Chung-Hsing Wang, Yung-Chin Hou | 2023-02-28 |
KC
Kuang-Hung Chang
Overall (2023): #360,776 of 537,848Top 70%
1
Patents 2023