Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11778727 | Semiconductor package assembly and method of manufacturing the same | Jian-Ting Chen, Cheng-Wei Lu | 2023-10-03 |
| 11693025 | Testing apparatus and method of using the same | Jian-Ting Chen, Cheng-Han Huang | 2023-07-04 |