JL

Jui Hsieh Lai

TSMC: 1 patents #2,163 of 4,064Top 55%
Overall (2023): #379,108 of 537,848Top 75%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11630271 Package structure Sung-Hui Huang, Shang-Yun Hou 2023-04-18