Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855130 | Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same | Chien-Chang Lee, Chia-Ping Lai, Tzu-Chung Tsai | 2023-12-26 |
| 11854969 | Semiconductor structure and method for forming thereof | Chia-Ping Lai | 2023-12-26 |
| 11854867 | Semiconductor structure and method for forming the same | — | 2023-12-26 |
| 11837586 | Package structure and method of forming thereof | Sheng-Chih WANG | 2023-12-05 |
| 11817373 | Semiconductor arrangement and method of making | — | 2023-11-14 |
| 11776896 | Capacitor device and manufacturing method thereof | Chia-Ping Lai, Chien-Chang Lee | 2023-10-03 |
| 11742325 | Semiconductor device including a plurality of dielectric materials between semiconductor dies and methods of forming the same | Tzu-Chung Tsai | 2023-08-29 |
| 11728301 | Semiconductor package including test pad and bonding pad structure for die connection and methods for forming the same | — | 2023-08-15 |
| 11728288 | Semiconductor die including guard ring structure and three-dimensional device structure including the same | Chien-Chang Lee, Chia-Ping Lai | 2023-08-15 |
| 11594497 | Electromagnetic shielding structure for a semiconductor device and a method for manufacturing the same | — | 2023-02-28 |