HT

Hsiao-Hui Tseng

TSMC: 1 patents #2,163 of 4,064Top 55%
📍 Tainan, TW: #338 of 806 inventorsTop 45%
Overall (2023): #420,439 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11728366 Extra doped region for back-side deep trench isolation Chun-Yuan Chen, Ching-Chun Wang, Dun-Nian Yaung, Jhy-Jyi Sze, Shyh-Fann Ting +4 more 2023-08-15