Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776814 | Method of forming semiconductor device by driving hydrogen into a dielectric layer from another dielectric layer | Yi-Fan Chen, Chun-Yen Peng, Cheng-Po Chau, Wen-Yu Ku, Huicheng Chang | 2023-10-03 |