Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854943 | Memory macro including through-silicon via | Hidehiro Fujiwara, Tze-Chiang Huang, Yen-Huei Chen, Hung-Jen Liao, Jonathan Tsung-Yung Chang +2 more | 2023-12-26 |
| 11723195 | Semiconductor device having an inter-layer via (ILV), and method of making same | Tsung-Hsien Huang, Hung-Jen Liao, Cheng Hung Lee | 2023-08-08 |
| 11562946 | Memory macro including through-silicon via | Hidehiro Fujiwara, Tze-Chiang Huang, Yen-Huei Chen, Hung-Jen Liao, Jonathan Tsung-Yung Chang +2 more | 2023-01-24 |