Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658044 | Thermally conductive structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2023-05-23 |
| 11574886 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2023-02-07 |