CO

Christine Y Ouyang

TSMC: 1 patents #2,163 of 4,064Top 55%
📍 Hsinchu, CA: #151 of 214 inventorsTop 75%
Overall (2023): #486,208 of 537,848Top 95%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11545370 Method for forming pattern and manufacturing method of package 2023-01-03