CL

Chin Kun Lan

TSMC: 3 patents #1,075 of 4,064Top 30%
Overall (2023): #84,323 of 537,848Top 20%
3
Patents 2023

Issued Patents 2023

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11818964 Spacer scheme and method for MRAM Joung-Wei Liou 2023-11-14
11785858 Methods for forming a spacer stack for magnetic tunnel junctions Joung-Wei Liou 2023-10-10
11769692 High breakdown voltage inter-metal dielectric layer Joung-Wei Liou 2023-09-26