Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855199 | High Electron Mobility Transistor (HEMT) with a back barrier layer | Pravanshu Mohanta, Ching-Yu Chen, Jiang-He Xie, Yu-Shine Lin | 2023-12-26 |
| 11804374 | Strain relief trenches for epitaxial growth | Yi-Chuan Lo, Pravanshu Mohanta, Jiang-He Xie, Ching-Yu Chen, Ming-Tsung Chen | 2023-10-31 |
| 11715792 | Barrier structure configured to increase performance of III-V devices | Yun-Hsiang Wang, Chun Lin Tsai, Jiun-Lei Jerry Yu, Po-Chih Chen, Ching-Yu Chen | 2023-08-01 |