CL

Chi-Yen Lin

TSMC: 2 patents #1,466 of 4,064Top 40%
DM Daxin Materials: 1 patents #1 of 7Top 15%
Overall (2023): #84,214 of 537,848Top 20%
3
Patents 2023

Issued Patents 2023

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11810879 Semiconductor structure including buffer layer Gulbagh Singh, Chih-Ming Lee, Wen-Chang Kuo, C. C. Liu 2023-11-07
11794381 Laser-debondable composition, laminate thereof, and laser-debonding method Shih-Yun CHIU, Cheng-Wei Lee 2023-10-24
11653498 Memory device with improved data retention Gulbagh Singh, Chen-Hao Li, Chih-Ming Lee, Cheng-Tsu Liu 2023-05-16