CS

Cheng-Bo Shu

TSMC: 3 patents #1,075 of 4,064Top 30%
📍 Tainan, TW: #118 of 806 inventorsTop 15%
Overall (2023): #83,897 of 537,848Top 20%
3
Patents 2023

Issued Patents 2023

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
11711917 Seal method to integrate non-volatile memory (NVM) into logic or bipolar CMOS DMOS (BCD) technology Chung-Jen Huang, Yun-Chi Wu 2023-07-25
11688805 Integrated circuit structure and method for forming the same Yun-Chi Wu 2023-06-27
11575008 Semiconductor arrangement and method of manufacture Yun-Chi Wu, Tsung-Yu Yang, Chien-Hung Liu 2023-02-07