Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776945 | Package-on-package structure including a thermal isolation material | Meng-Tse Chen, Kuei-Wei Huang, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu | 2023-10-03 |
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Ai-Tee Ang
Overall (2023): #532,095 of 537,848Top 100%
1
Patents 2023