KA

Kodama Akira

SC Suncall Technologies (Sz) Co.: 1 patents #4 of 9Top 45%
📍 Lo Wu, CN: #931 of 2,697 inventorsTop 35%
Overall (2023): #363,382 of 537,848Top 70%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11543601 MPO connector with high-density release clip and connector release tool Benliang Xiao, Qiyue Wang, Xiaohui Liu, Masaya Nakagawa 2023-01-03