Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11677062 | Method of manufacturing light source device having a bonding layer with bumps and a bonding member | Takashi Matsumoto, Fukutaro Saegusa, Yoshiyuki Kageyama | 2023-06-13 |