Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621209 | Semiconductor device thermal bump | Lei Ma, Wenyue Zhang, William Clinton Burling PEATMAN | 2023-04-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11621209 | Semiconductor device thermal bump | Lei Ma, Wenyue Zhang, William Clinton Burling PEATMAN | 2023-04-04 |