Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764136 | Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure | KyuWon Lee, Mark Sackett | 2023-09-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764136 | Semiconductor device and method of forming bump pad array on substrate for ground connection for heat sink/shielding structure | KyuWon Lee, Mark Sackett | 2023-09-19 |