Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11850780 | Resin member, mold for molding resin member, and method for manufacturing resin member | Sakura Nakano, Masaaki Akamine, Kaname Sawai, Akihiro Hosono, Shuhei Narita | 2023-12-26 |
| 11783622 | Fingerprint authentication device and fingerprint authentication method | — | 2023-10-10 |
| 11668838 | Communication apparatus, information processing apparatus, and information processing method | — | 2023-06-06 |
| 11573334 | Information processing device, information processing method, and program | — | 2023-02-07 |