Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11850685 | Solder material | Hirohiko Watanabe, Yoshihiro Kodaira | 2023-12-26 |
| 11854555 | Audio signal processing apparatus, method of controlling audio signal processing apparatus, and program | Hajime HORIKOSHI, Yuki KARATSU, Kaoru Yamanoue, Yoshimichi Kitaya, Erik Beran +2 more | 2023-12-26 |