Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652079 | Backside metalization with through-wafer-via processing to allow use of high Q bond wire inductances | Grant Darcy Poulin | 2023-05-16 |
| 11621676 | Auto-linearizing amplifier | Mackenzie Brian Cook | 2023-04-04 |