Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569216 | Semiconductor package including stacked semiconductor chips and method for fabricating the semiconductor package | Gyu Jei LEE, Jong Hoon Kim, Tae Hun Yi | 2023-01-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11569216 | Semiconductor package including stacked semiconductor chips and method for fabricating the semiconductor package | Gyu Jei LEE, Jong Hoon Kim, Tae Hun Yi | 2023-01-31 |