Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11730062 | Electronic device including thermal stability enhanced layer including homogeneous material having Fe-O bond | Tae Young Lee, Guk-Cheon Kim, Soo Gil Kim, Jong-Koo Lim, Taiga ISODA | 2023-08-15 |