Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823975 | Semiconductor packages including different type semiconductor chips having exposed top surfaces and methods of manufacturing the semiconductor packages | — | 2023-11-21 |
| 11764128 | Semiconductor chip including through electrode, and semiconductor package including the same | Seung Hwan Kim, Hyeong-Seok Choi, Moon Un Hyun | 2023-09-19 |
| 11682614 | Semiconductor package and package substrate including vent hole | Jun Sik Kim | 2023-06-20 |