Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784100 | Method of manufacturing a molded flip chip package to facilitate electrical testing | Jee Won Chung, Dong Jin Kim, Chang Hyun Kim | 2023-10-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784100 | Method of manufacturing a molded flip chip package to facilitate electrical testing | Jee Won Chung, Dong Jin Kim, Chang Hyun Kim | 2023-10-10 |