Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545385 | Method for fabricating electronic package and carrier structure thereof | Tse-Yuan Lin, Yu-Chih Cheng | 2023-01-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545385 | Method for fabricating electronic package and carrier structure thereof | Tse-Yuan Lin, Yu-Chih Cheng | 2023-01-03 |