Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735503 | Method of manufacturing chip packaging structure with dissipation layer, flange and sealing pin | — | 2023-08-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735503 | Method of manufacturing chip packaging structure with dissipation layer, flange and sealing pin | — | 2023-08-22 |