Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11618182 | Method for fabrication of 3D printed part with high through-plane thermal conductivity | Yinghong Chen, Jingjing Jing, Ning Chen | 2023-04-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11618182 | Method for fabrication of 3D printed part with high through-plane thermal conductivity | Yinghong Chen, Jingjing Jing, Ning Chen | 2023-04-04 |