Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11553593 | Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board | Ikuo Sugawara, Tetsurou Irino, Yuuki Tezuka, Masaharu Matsuura | 2023-01-10 |