Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11818847 | Resist layer forming method, method for manufacturing wiring board, and resist layer forming apparatus | Toyoaki Sakai | 2023-11-14 |
| 11632862 | Wiring board | Junichi Nakamura, Takeshi Takai, Yusuke Karasawa, Shuhei Momose, Toshiki Shirotori | 2023-04-18 |
| 11574866 | Wiring substrate and manufacturing method thereof | Tomoyuki Shimodaira, Takashi Sato | 2023-02-07 |