Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11792927 | Interconnect substrate | Noriyoshi Shimizu, Hiroshi Taneda, Masaya Takizawa, Yoshiki Akiyama | 2023-10-17 |
| 11729914 | Wiring board | Hiroshi Taneda, Noriyoshi Shimizu, Masaya Takizawa, Yoshiki Akiyama | 2023-08-15 |
| 11716810 | Wiring board | Masaya Takizawa, Hiroshi Taneda, Yoshiki Akiyama, Noriyoshi Shimizu | 2023-08-01 |