Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11584037 | Wire saw apparatus and method for manufacturing wafer | Toshiaki Otaka, Tatsuo Enomoto, Yuichi Shimizu | 2023-02-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11584037 | Wire saw apparatus and method for manufacturing wafer | Toshiaki Otaka, Tatsuo Enomoto, Yuichi Shimizu | 2023-02-21 |