Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11802192 | Low dielectric resin substrate | Toshio Shiobara, Hajime ITOKAWA | 2023-10-31 |
| 11678432 | Low dielectric substrate for high-speed millimeter-wave communication | Toshio Shiobara, Ryunosuke Nomura | 2023-06-13 |