Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11622475 | Power module having metallic heat-dissipation substrate | Da Jin, Yahong Xiong | 2023-04-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11622475 | Power module having metallic heat-dissipation substrate | Da Jin, Yahong Xiong | 2023-04-04 |