Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545517 | Chip package structure, electronic device and method for preparing a chip package structure | — | 2023-01-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11545517 | Chip package structure, electronic device and method for preparing a chip package structure | — | 2023-01-03 |