Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11641719 | Manufacturing method of printed circuit board | Hegen Zhang, Jinfeng Liu, Fuyu Xiang, Bo Wang, Zhicheng Yang | 2023-05-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11641719 | Manufacturing method of printed circuit board | Hegen Zhang, Jinfeng Liu, Fuyu Xiang, Bo Wang, Zhicheng Yang | 2023-05-02 |