Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664228 | Vacuumizing device and vacuumizing method for bonding substrate | Zhijun Huo, Bin Zhao, Hui Fu, Xingxing Wang | 2023-05-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664228 | Vacuumizing device and vacuumizing method for bonding substrate | Zhijun Huo, Bin Zhao, Hui Fu, Xingxing Wang | 2023-05-30 |