LC

Lufeng Che

ZU Zhejiang University: 1 patents #89 of 552Top 20%
Overall (2023): #350,146 of 537,848Top 70%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11780727 Low-stress packaging structure for MEMS acceleration sensor chip — 2023-10-10